以600mm×600mm面板为例，其面积是12英寸晶圆载板的5.1倍，单片产出芯片数量大幅增加。同时，FOPLP的面积利用率超95%，显著优于传统晶圆级封装的85%，同等面积下面板可多容纳1.64倍芯片。基板面积增大持续降低成本，200mm向300mm过渡节约25%成本，300mm向板级封装过渡更可节约66%成本。
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100多年来，践行初心、担当使命，伟大建党精神融入党的精神血脉，贯穿党的奋斗历程，滋养着、激励着一代代共产党人。
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"We’ve done a lot to improve performance and consistency in Node streams, but there’s something uniquely powerful about starting from scratch. New streams’ approach embraces modern runtime realities without legacy baggage, and that opens the door to a simpler, performant and more coherent streams model."
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